| abstract |
A semiconductor device has a substrate in which a first opening and a second opening are formed in the substrate. A first semiconductor component is disposed on the substrate. The substrate is placed on a carrier. A second semiconductor component is disposed on the carrier in the first opening of the substrate. A third semiconductor component is disposed in the second opening. In some embodiments, the third semiconductor component is a semiconductor package. A first shielding layer can be formed over the semiconductor package. A sealant is deposited over the substrate, the first semiconductor member, and the second semiconductor member. A shielding layer can be formed over the encapsulant. |