| abstract |
An electronic component mounted component and a method for manufacturing an electronic component mounted finished product, and an electronic component mounted finished product are provided. A semiconductor element 111 having an electrode 112 and a passive element 113 having an electrode 113a are embedded in a thermoplastic sheet substrate 115, and then the electrodes 112 and 113a are exposed by laser processing, electron beam processing, or ion beam processing. . Thereafter, a circuit pattern 119 is formed by thin film formation or printing with a conductive adhesive. Since the electrode is exposed by laser processing or the like in this way, the exposure process can be performed in a short time, and since the local process is sufficient, the damage to the substrate can be reduced, and the high quality, high Productive and inexpensive electronic component mounted component manufacturing method, electronic component mounted finished product manufacturing method, and electronic component mounted finished product can be provided. [Selection] Figure 1 |