| abstract |
A combined interposer ( 120 ) includes multiple constituent interposers ( 120. i ), each with its own substrate ( 120. i S) and with a circuit layer (e.g. redistribution layer) on top and/or bottom of the substrate. The top circuit layers can be part of a common circuit layer ( 120 R.T) which can interconnect different interposers. Likewise, the bottom circuit layers can be part of a common circuit layer ( 120 R.B). The constituent interposer substrates ( 120. i S) are initially part of a common wafer, and the common top circuit layer is fabricated before separation of the constituent interposer substrates from the wafer. Use of separated substrates reduces stress compared to use of a single large substrate. Other features are also provided. |