| abstract |
The present invention discloses a structure of package comprising: a substrate with a die receiving through holes, a conductive connecting through holes structure and coupled a first contact pad on the upper surface of the substrate and a second contact pads on lower surface of the substrate; at least a die with metal pads disposed within the die receiving through holes; a surrounding material formed under the die and filled in the gap between the sidewall of die and sidewall of the die receiving though holes; a re-distribution layer (RDL) formed on the die, substrate and surrounding material; and coupled the metal pads of the die to the first contact pad; an isolating base having adhesion material formed over the RDL. |