| abstract |
Disclosed is a method for producing an electronic device, comprising: a fixing resin layer forming step for providing a fixing resin layer on a surface of a support substrate; an electronic component fixing step for disposing multiple electronic components on the fixing resin layer such that a space is formed between adjacent electronic components, and fixing the electronic components to the support substrate via the fixing resin layer; a sealing component forming step for covering the electronic components with a sealing component to thereby form a sealing component layer on the fixing resin layer and on the electronic component; a sealing component curing step for curing the sealing component by heating to thereby obtain a cured sealing component which is supported on the support substrate and on which the electronic components are disposed; and a removing step for removing from the support substrate the cured sealing component which is supported on the support substrate and on which the electronic components are disposed, wherein in the removing step, resin contained in the fixing resin layer is changed into a low-molecular-weight substance to thereby remove the cured sealing component from the support substrate. |