| abstract |
According to the invention, there is provided a semiconductor device manufacturing method comprising: preparing an interconnection forming assembly by providing a peel layer (22) a base plate (23), under an interconnection forming metal foil (21) the forming interconnections (2) by patterning the interconnection forming metal foil (21); bonding a semiconductor component (6) to the interconnections (2), the semiconductor component (6) including a semiconductor substrate (7) and a plurality of external connection electrodes (12) being provided on an underside of the semiconductor substrate (7); covering at least a part of the semiconductor component (6) and the interconnections (2) with a sealing medium (14); and removing the base plate (23). |