| abstract |
It is possible to directly mount electronic parts on the conductor wiring without forming a solder resist, and it has excellent high-speed transmission characteristics, expanding the wiring rules for the electrode terminals of the built-in functional elements, and working in the process of connecting to electronic devices Provided are a circuit board, an electronic device apparatus, and a circuit board manufacturing method capable of being mounted with excellent reliability and reliability. The functional element 1 having the electrode terminal 5, the base material in which the functional element 1 is incorporated and at least one layer of conductor wiring is formed on each of the front and back surfaces, and the electrode terminal 5 and the conductor wiring 3 formed on the base material are connected. And the conductor wiring formed on either the front surface side or the back surface side of the substrate has the same plane as the surface on which the conductor wiring is formed on the substrate. Or inward of it. |