| abstract |
The present invention discloses a semiconductor packaging method, comprises steps of back lapping a processed silicon wafer to a desired thickness. Then, the dice are separated from the processed and lapped wafer into a single die. Then, the dice are picked and placed on a tool, an active surface of the dice is attached on the tool. A molding is performed to mold the dice by molding material. The tool is then removed from the dice to form a small unit. The next step is to arrange a plurality of the small units on a carrier in a matrix from. Then, a build-up layer, a re-distribution layer are formed over the dice, followed by forming solder balls on the dice. Finally, the carrier is removed. |