patent/DE-102011000530-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102011000530-A1

Outgoing Links

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filingDate	2011-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c7f7bab3e60058835ffc1de6779dba6
publicationDate	2011-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	DE-102011000530-A1
titleOfInvention	Method for producing a semiconductor device
abstract	Metal particles (11) are applied to a metal foil (10). A semiconductor chip (12) is placed over the metal foil (10), contact elements (13) of the semiconductor chip (12) facing the metal particles (11). The metal particles (11) are heated and the metal foil (10) is patterned after the heating of the metal particles (11).
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013174418-A1
priorityDate	2010-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6327157 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426098968

Total number of triples: 85.