| abstract |
The invention relates to a method for producing an electronic subassembly (1), comprising: 1.1 providing an electrically conductive film (3), in particular a carrier film (3a), 1.2 providing at least one electric component (5) having at least one electric contact point (5c), 1.3 applying an adhesive (20) between the electric component and a surface (30) of the electrically conductive film, 1.4 arranging the at least one component (5) having the at least one electric contact point (5c) on the surface (30) of the electrically conductive film (3) and fixing the at least one component by forming an adhesive bond between the electric component and the surface, 1.5 providing a carrier (19), in particular made of a flexible material, 1.6 laminating the film (3) with the carrier (19) such that the at least one electric component (5) is arranged between the film (3) and the carrier (19), and forming a mechanical and electrical connection between the electric contact point of the at least one electric component (5) and the electrically conductive film (3) by means of low-temperature sintering of nanoparticles, in particular made of gold, silver, nickel or copper or of an alloy of said metals, wherein the lamination of the film is carried out at the same time as the low-temperature sintering, 1.7 structuring the electrically conductive film (3) to form conductor tracks and/or cooling surfaces. |