| abstract |
Embodiments of the present application relate to semiconductor packages and methods for fabricating the semiconductor packages. The invention discloses a semiconductor package comprising at least one semiconductor element, a package body, a first circuit, a second circuit and at least one first stud bump. The package body covers at least a part of the semiconductor element. The package body has a first surface and a second surface opposite to the first surface. The first circuit is disposed adjacent to the first surface of the package. The second circuit is disposed adjacent to the second surface of the package. The first stud bumps are disposed in the package body and electrically connect the first circuit and the second circuit. The first stud bump directly contacts the second circuit. |