| abstract |
A packaging structure including a redistribution circuit structure, a first circuit board, a second circuit board, a first insulator, a plurality of conductive terminals, and a package device is provided. The redistribution circuit structure has a first connection surface and a second connection surface opposite to the first connection surface. The first circuit board and the second circuit board are disposed on the first connection surface and are electrically connected to the redistribution circuit structure. The first insulator is disposed on the first connection surface and covers the first circuit board and the second circuit board. The conductive terminals are disposed on the first circuit board or the second circuit board and are electrically connected to the first circuit board or the second circuit board. The package device is disposed on the second connection surface and is electrically connected to the redistribution circuit structure. The package device includes at least one chip, an encapsulant, a circuit layer, and a plurality of conductive package terminals. A manufacturing method of a package structure is also provided. |