Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d34fa1d0e297c04904926b0a787ecab1 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01059 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
filingDate |
2008-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd3836ae854a592fd01c5cfd3904d6bb |
publicationDate |
2008-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20080064088-A |
titleOfInvention |
Wafer level package with die receiving through hole and method thereof |
abstract |
The invention provides a substrate having a die receiving through hole, a coupling through hole structure and a first contact pad; A die disposed in the die receiving through hole; A surrounding material formed below the die and filled in a gap between the die and sidewalls of the die receiving through hole; A dielectric layer formed on the die and the substrate; A re-distribution layer (RDL) formed on the dielectric layer and bonded to the first contact pad; A protective layer formed on the RDL; And a second contact pad formed on a lower surface of the substrate and under the coupling through hole structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160039752-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10431615-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101634067-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9653397-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180032914-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10580812-B2 |
priorityDate |
2007-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |