| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method for manufacturing the same, wherein a plurality of external connection electrodes are provided on a base member (1) and on the base member (1) and on the semiconductor substrate (4) and the semiconductor substrate (4). At least one semiconductor structure 2 having (5, 12), an insulating layer 15 provided on an area of the base member 1 corresponding to the periphery of the semiconductor structure 2, and the semiconductor structure 2 ), An adhesion force improving film 14a provided between at least one of the region of the base member 1 and the insulating layer 15 corresponding to the circumference of the semiconductor structure 2 between the circumferential side surface and the insulating layer 15. , 14b).n n n n Columnar electrode, semiconductor structure, adhesive layer, adhesion improvement film, insulating film, sealing film |