| abstract |
In one embodiment, the device comprises: a processor die comprising a circuit block, the circuit block comprising an active device of a first technology node; a power gating die comprising a power semiconductor device of a second technology node, wherein the second technology node is larger than the first technology node; and a first redistribution structure comprising a first metallization pattern, wherein the first metallization pattern includes a power supply source line and a power supply ground line, wherein one subset is permanently electrically coupled to the power supply source line and the power supply ground line through the power semiconductor device, and the second subset of circuit blocks is permanently electrically coupled to the power supply source line and the power supply ground line. Ringed - . |