| abstract |
A method of forming a bonded structure and a bonded structure is provided. A conductive layer is formed on a first surface of the junction structure, the junction structure including a first substrate bonded to a second substrate, the first surface of the junction structure having an exposed surface to be. A patterned mask having a first opening and a second opening is formed on the conductive layer, and the first opening and the second opening expose portions of the conductive layer. A first portion of the first connector is formed in the first opening and a first portion of the second connector is formed in the second opening. A conductive layer is patterned to form a second portion of the first connector and a second portion of the connector. And the junction structure is bonded to the third substrate using the first junction connector and the second junction connector. |