| abstract |
Device comprising: an IC die (114) on a first dielectric layer (108), the IC die having a die connector (126); a molding compound (130) encapsulating the IC die (114); and a redistribution structure (132) comprising: a first conductive via (134) on the die connector (126) of the IC die (114), the first conductive via having a top surface a first distance from the first dielectric layer (108); a second dielectric layer (136) on the IC die (114), the molding compound (130) and the first conductive via (134), the second dielectric layer (136) having a main surface that is a second distance from the first dielectric layer ( 108) is removed, the first distance being greater than the second distance and with sides and top surface of the first conductive via (134) exposed from the second dielectric layer (136); and a first electrical line (144) on the first conductive via (134), the first electrical line (144) contacting the sides and top surface of the first conductive via. |