| abstract |
This application discloses a package structure and a method of forming the package structure. The method includes depositing and patterning a first dielectric material. A first dielectric material is deposited in the first and second package component regions and in the dicing line region. The dicing line region is between the first and second package component regions. Patterning the first dielectric material forms a first dielectric layer in the first and second package component regions and forming a dummy block in the dicing line region, respectively. The virtual block is separated from the first dielectric layer in the first and second package component regions. The method further includes forming a metallization pattern on the first dielectric layer, depositing a second dielectric material on the first dielectric layer and the metallization pattern, and patterning the second dielectric material to form a second dielectric layer. |