| abstract |
The invention relates to a semiconductor chip with a semiconductor substrate (11), which includes a cell region (A¶cell1¶, A¶cell2¶) and an adjacent peripheral circuit region (A¶peri¶), and with one formed on the semiconductor substrate Bond contact point wiring structure (12) and a multi-chip package with such a chip. According to the invention, a contact point reorganization structure (15) is provided which is electrically connected to the bond pad wiring structure and has a bond contact point (17) which is arranged over at least part of the cell area, the bond pad wiring structure essentially in a central area of the semiconductor substrate is arranged and / or a part of the contact point rearrangement structure essentially extends from a central region of the semiconductor substrate to an edge region thereof. DOLLAR A use e.g. B. for multi-chip packages with memory components. |