| abstract |
The present invention realizes high-precision chip mounting, does not require a position mark at the time of chip mounting on the base material during the manufacturing process, and facilitates removal of the base material. Provided are a semiconductor device that realizes low cost and a manufacturing method thereof. A transparent substrate is disposed on a support substrate on which a position mark is provided, and a release material is provided. On top of that, the semiconductor element 11 is arranged so that the electrode element 13 is on top, and then the support substrate 21 is removed. Next, after the insulating resin 12 is formed on the release material 24 so as to cover the semiconductor element 11, the via 14, the wiring layer 15, the insulating layer 16, the external terminal 17, and the solder resist 18 are formed. Thereafter, the transparent substrate 23 is peeled from the semiconductor device by the peeling material 24. [Selection] Figure 9 |