| abstract |
A board for electronic component packaging includes: a wiring portion on which the electronic component is disposed, wherein the wiring portion includes an insulating layer, a signal transmission wiring electrically connected to the electronic component, and the electronic component An electrical test wiring electrically disconnected from the element, and the electrical test wiring includes a conductive pattern formed on both surfaces of the wiring portion, and a conductive via window electrically connecting the conductive pattern to each other . |