| abstract |
The method includes: forming a release film on a carrier, forming a metal post on the release film, encapsulating a metal post in an encapsulating material, and an encapsulating material to expose the metal post. The step of performing planarization for, forming a redistribution structure on the encapsulating material and the metal post, disassembling the first part of the release film to separate the second part of the release film from the carrier, the release film to expose the metal post Forming an opening therein. |