| abstract |
A semiconductor device includes a ball grid array (BGA) package including a first bump. A first semiconductor die is mounted to the BGA package between the first bumps. The BGA package and the first semiconductor die are mounted to a carrier. A first encapsulation system is deposited over the carrier and around the BGA package and the first semiconductor die. The carrier is removed to expose the first bumps and the first semiconductor die. An interconnect structure is electrically connected to the first bumps and the first semiconductor die. The BGA package further includes a substrate and a second semiconductor die mounted and electrically connected to the substrate. A second encapsulation system is deposited over the second semiconductor die and the substrate. The first bumps are formed on the substrate relative to the second semiconductor die. A warpage balancing layer is formed over the BGA package. |