| abstract |
A good method of manufacturing a semiconductor device using an interposer method and a good device obtained thereby are provided. The semiconductor device includes at least one semiconductor die. The window substrate 110 is an inorganic substrate having at least one window-shaped cavity 120 to which the at least one semiconductor die is attached, and has an interconnect structure 140. In addition, at least one semiconductor die is positioned within the at least one cavity and connected to the interconnect structure to provide connection to another level of assembly or packaging of the semiconductor device 100. [Selection] Figure 2 |