| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47952a9e73dffc822f299776e4668cf0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ef54ef938bec64ec43262099ff28c80c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_46902fab38a4dd5a681f66448e27a8c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f10653472598ed4110c8cfcf8addbac7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3979e77459a87ec06957735358697a5e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1469
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate |
2012-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad6eee56701f9336d839897d4ab6b376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b06b0552adb1892ff3539c5dc50ed97d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69b8b17a50ff870a6bc92958af16b3de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e98173cdf2480460c23428191153368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8eb48134725c60097131beb6f8ce1ba |
| publicationDate |
2012-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012295404-A1 |
| titleOfInvention |
Method of manufacturing semiconductor package |
| abstract |
A method of manufacturing a semiconductor package, the method including: forming an insulating layer on a board; forming an electrode pattern portion by redistribution plating in order to make a circuit connection on the insulating layer; manufacturing a semiconductor chip by forming a protecting portion on the electrode pattern portion such that a portion of the electrode pattern portion is exposed; and mounting the semiconductor chip on a receiving space of a circuit board and electrically connecting the semiconductor chip to the circuit board. |
| priorityDate |
2009-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |