| abstract |
The present invention relates to various combinations of molded chips and methods of making them. In one aspect, the invention provides a molded chip combination that includes a first semiconductor chip (20) having a first PHY region (75), a second semiconductor chip (19) having a second PHY region (65), an interconnect chip (85) interconnecting the first PHY region to the second PHY region, and a molding (25) uniting together the first semiconductor chip, the second semiconductor chip and the interconnection chip. |