http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9831142-B2

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filingDate 2016-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6690811e2d83f583e6a287a45275aa3b
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publicationDate 2017-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9831142-B2
titleOfInvention Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package
abstract A board for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10418317-B2
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