Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68359 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55f458d34199152a5f7337399f9f5b0e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5eba1f4491d980b735f84c183de6dd90 |
publicationDate |
2017-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9553001-B2 |
titleOfInvention |
Method of forming a molding layer for semiconductor package |
abstract |
A method of forming a molding layer includes the following operations: forming a substrate having at least one column structure thereon; flipping over the substrate having the column structure such that the column structure is beneath the substrate; dipping the column structure of the flipped substrate into a molding material fluid contained in a container; and separating the column structure of the flipped substrate from the container to form a molding layer covering and in contact with the column structure. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021242083-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11651994-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10964591-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10361122-B1 |
priorityDate |
2015-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |