patent/US-2011227219-A1

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filingDate	2010-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cec42600b43fb425e4b9815e8bc29806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01bacc0ce8f494aa6011779dcf189617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_518a1308c8692064476cc8692929e3b8
publicationDate	2011-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2011227219-A1
titleOfInvention	Enhanced wlp for superior temp cycling, drop test and high current applications
abstract	A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection.
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