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Object |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c47f34a3c6b41c916a73f506e84c37 |
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| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
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| classificationIPCInventive |
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| filingDate |
2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8794c303a420aaca3e601c541af93238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2f474cf4c93e68651c7b801b1732544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75b59067cb316358426dbd920e313803
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d907ea1b47ddcf0f32072040a0c36040
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb2e7806563c3e9b50cd893aa49f4516 |
| publicationDate |
2018-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2018005912-A1 |
| titleOfInvention |
Wafer level chip scale package structure and manufacturing method thereof |
| abstract |
A wafer level chip scale package (WLCSP) structure and a manufacturing method are disclosed. The WLCSP structure comprises a semiconductor die and a stack. The stack comprises a protective tape and a molding compound. A portion of a first interface surface between the molding compound and the protective tape is curved. The manufacturing method comprises the steps of forming a semiconductor structure; attaching the semiconductor structure on a dummy wafer; performing a first dicing process using a first cutting tool; depositing a molding compound; removing the dummy wafer; performing a second dicing process with a second cutting tool. A first aperture of the first cutting tool is larger than a second aperture of the second cutting tool. The portion of the first interface surface being curved reduces the possibility of generation of cracks in the WLCSP structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11031483-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11393785-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11393786-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-3104315-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-3085575-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021265484-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-3093230-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11158556-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11784104-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11574816-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019296125-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11289391-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3832704-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3618106-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11735642-B2 |
| priorityDate |
2016-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |