| abstract |
The package comprises: a first die, the first die comprising: a first metallization layer; One or more first bond pad vias on the first metallization layer; And one or more first bond pads on the one or more first bond pad vias, wherein the first barrier layer extends over the first metallization layer between each first bond pad via and the first metallization layer, The second barrier layer extends over each first bond pad via between the first bond pad and the first bond pad via; And a second die comprising one or more second bond pads, the second bond pad bonded to the first bond pad of the first die. |