| abstract |
A method for producing a semiconductor component with a plastic housing, in which at least one semiconductor chip is arranged, is presented, which comprises the following steps: Providing a semiconductor wafer having semiconductor chips arranged in rows and columns and having active tops and back sides, the active tops being provided with contact surfaces; Separating the semiconductor wafer into individual semiconductor chips; Providing a support plate, which is provided on its upper side with a thermo-sensitive adhesive; Equipping this carrier plate with the individual semiconductor chips, wherein the individual semiconductor chips are brought with their active tops on the top of the carrier plate; Producing a common carrier made of plastic housing material on the support plate, wherein the semiconductor chips are embedded in the plastic housing composition; Removing the carrier plate by heating the thermosensitive adhesive to a predetermined defined temperature at which the thermosensitive adhesive loses its adhesive effect. |