| abstract |
A transition layer 38 is provided on a die pad 22 of annIC chip 20 and integrated into a multilayer printed circuit boardn10. Due to this, it is possible to electrically connect thenIC chip 20 to the multilayer printed circuit board 10 withoutnusing lead members and a sealing resin. Also, by providing thentransition layer 38 made of copper on an aluminum pad 24, itnis possible to prevent a resin residue on the pad 24 and to improvenconnection characteristics between the die pad 24 and a via holen60 and reliability. |