http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005157477-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-04941
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06524
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
filingDate 2004-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a284b64982518eabd3804ad3c162b55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5bff7be323f4f241ec36ef0bcdfb317
publicationDate 2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2005157477-A1
titleOfInvention Electronic device and production method thereof
abstract An object is to provide an electronic device of a multilayer structure with high density and high reliability that can be reduced in size while incorporating an electronic component therein, and further provide a production method for easily producing such an electronic device. An electronic device of the present invention includes wiring layers and electrically insulating layers stacked on a core board and establishes predetermined electrical conduction between the wiring layers through upper-lower side conducting vias provided in the electrically insulating layers. An electronic component incorporating layer formed by directly forming on a lower layer an insulating resin layer having a cutout portion for receiving an electronic component therein and upper-lower side conducting vias and by incorporating the electronic component in the cutout portion is provided at least between one of the wiring layers and one of the electrically insulating layers and/or between the core board and the electrically insulating layer. At least the uppermost-layer electronic component incorporating layer of electronic component incorporating layers has a metal frame body surrounding the electronic component and the upper-lower side conducting vias, and a metal cap having a flange portion fixed to the metal frame body of the uppermost-layer electronic component incorporating layer is provided.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8900932-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7400035-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9107295-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8314481-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009102050-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008129424-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013146352-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008129424-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7960210-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007023758-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009081861-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011018123-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8357568-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012314390-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7968991-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7544599-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005269128-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8384060-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008246135-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7799604-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11289409-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7863188-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020123001-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009267219-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008258284-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7683268-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006043568-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009230376-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009269891-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007257356-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006275943-A1
priorityDate 2003-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6353189-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5818699-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002162687-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6376052-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6815739-B2
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6660
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414859488
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129389030
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61209
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128779482
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727

Total number of triples: 105.