| abstract |
A method of manufacturing a semiconductor package, comprising: applying a flux containing carbon nanotubes on a connection pad of a substrate having a connection pad on a first surface; placing a solder ball on the flux-applied connection pad; A solder layer adhered to the connection pad is formed from the solder ball by alow process and the semiconductor chip is mounted on the substrate so that the reflowed solder ball faces the connection pad provided on the semiconductor chip. |