http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49513
Outgoing Links
| Predicate | Object |
|---|---|
| concordantIPC | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| level | 12^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H01L23/49513 |
| modified | 2013-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Lead-frames characterised by the die pad having bonding material between chip and die pad |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49503 |
Incoming Links
Total number of triples: 2191.