| abstract |
The present invention provides a resin composition in which excellent adhesive strength is exhibited in the manufacture of a semiconductor device and peeling of a cured product is suppressed in a high-temperature process. (A) inorganic filler, (B) thermosetting resin, (C) curing agent, (D) (D1) metal salt of organic acid having a boiling point of 200°C or higher, and/or (D2) organic acid and metal particles having a boiling point of 200°C or higher And/or a combination of metal oxide particles, (E) a resin composition containing a polysulfide compound, or (A) an inorganic filler, (B) a thermosetting resin, (C) a curing agent, (D) (D1) ) As a resin composition comprising a metal salt of an organic acid having a boiling point of 200° C. or higher, and/or (D2) a combination of an organic acid having a boiling point of 200° C. or higher and metal particles and/or metal oxide particles, and (E') a secondary antioxidant. , A die attach paste containing these resin compositions or an adhesive for heat dissipating members, and to a semiconductor device manufactured using these die attach pastes or an adhesive for heat dissipating members. |