abstract |
[Subject] Improving the reliability of semiconductor devices. [Solution] A method for manufacturing a semiconductor device according to an embodiment includes the following steps: while pressing a ball portion of a first wiring contacting a first electrode of a semiconductor wafer with a load M3, the ball portion is pressed onto the ball portion An activation step ST5 of applying ultrasonic waves. In addition, the method of manufacturing the semiconductor device further includes the following steps: after the first step, the ball is pressed with a load M4 larger than the load M3, and the ultrasonic wave is applied to the ball to load the ball. The main joining step ST 6 in which the ball portion is joined to the first electrode. |