| abstract |
By this invention, while being excellent in application | coating workability, when used as an adhesive agent for a die attach material or a heat radiation member, the resin composition which can provide reliability, such as solder reflow resistance, with respect to a semiconductor device is provided. The resin composition of the present invention contains a (meth) acrylic polymer or copolymer having a reactive functional group capable of reacting with a polymer or copolymer of a conjugated diene compound having at least one functional group, a thermosetting resin and another reactor. |