| abstract |
To provide a support member that needs to be bonded at a relatively low temperature by a printing method, and to reduce the time of the B stage process, the B stage and post-curing processes are performed. Provided are a paste that can be performed by different methods, has good adhesive strength, and suppresses voids and film loss after curing, a method of manufacturing a semiconductor device using the paste, and a semiconductor device. SOLUTION: (A) Acrylic ester compound or methacrylic ester compound, (B) epoxidized polybutadiene or carboxy-terminated acrylonitrile butadiene copolymer, (C) photopolymerization initiator, (D) thermosetting resin and (E) ) A resin paste for die bonding comprising a filler, a method of manufacturing a semiconductor device using the same, and a semiconductor device. [Selection figure] None |