| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0c20dac5f1a44475c96d2db944e79786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5cfbeb397e45d04c6993af0e595df91
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ae4786cd84288d25756d0d1e226eb82c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c6cadf0d51dac5cec5f9d1a2ddd70d70 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2012-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a935c0eee249da7f8cb1bd0d5433b302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_392b64a13bc7ef74d6fff0e3850c666f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_983b45f840ebb99a4bdef89ed7106528 |
| publicationDate |
2016-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9249294-B2 |
| titleOfInvention |
Conductive resin composition and cured product thereof |
| abstract |
A conductive resin composition which includes an epoxy resin (A), a compound (B) having a (meth)acryloyl group and a glycidyl group, a phenolic resin curing agent (C), a radical polymerization initiator (D) and a conductive particle (E). The conductive resin composition which may be B-staged (semi-cured) at a relatively low temperature to exhibit sufficient tack-free properties and excellent pressure-sensitive tackiness. This permits temporary bonding of parts without involving solvent evaporation or light illumination, thereby reducing or avoiding an increase in facility costs. The conductive resin composition may thereafter be cured (C-staged) to provide a cured product having a desirable bond strength, while maintaining a low specific resistivity. |
| priorityDate |
2011-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |