| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49537
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49558
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4828
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-84 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate |
2018-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-3219487-U |
| titleOfInvention |
Pre-formed lead frame |
| abstract |
The present invention provides a preformed lead frame that makes it easy to observe the soldering state with the outside. A molding resin layer is provided so as to directly cover a lead frame, and an upper surface on the same plane as a top surface of the lead frame and a bottom surface of the lead frame unit. It has a certain bottom surface 32 and a plurality of solder grooves 33 formed to be recessed from the bottom surface 32. [Selection] Figure 3 |
| priorityDate |
2017-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |