| abstract |
According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d 95 in the volume-based particle size distribution of the metal particles as determined with a flow-type particle image analyzer is 10 μm or less. In other words, the volume ratio of metal particles having a particle diameter that exceeds 10 μm is less than 5%. Here, d 95 indicates the particle diameter at which the cumulative volume ratio thereof is 95%. |