| abstract |
Provided are a semiconductor-sealing resin composition that includes an epoxy resin (A), a hardening agent (B), and an inorganic filler (C), and that is characterized in that the epoxy resin (A) includes an epoxy resin (A1) with a predetermined structure, and the hardening agent (B) includes a phenol resin (B1) with a predetermined structure, wherein the content of a c = 1 component included in the total volume of the phenol resin (B1) is 40% or more in area percentage and the content of a c ≧ 4 component is 20% or less in area percentage as measured by the area method of gel permeation chromatography, as well as a semiconductor device that is characterized in that a semiconductor element is sealed with the hardening agent of the semiconductor-sealing resin composition. |