| abstract |
The present invention provides a liquid resin composition having excellent flatness after screen printing, B-stage stability, dicing tape sticking property, dicing property, and adhesion to a lead frame. [Solution] (A) Epoxy resin containing two or more epoxy groups in one molecule, (B) Epoxy group 1 in component (A) with a curing agent containing two or more groups reactive with epoxy groups in one molecule The amount of the group having reactivity with the epoxy group in (B) is 0.8 to 1.25 equivalent with respect to the equivalent, (C) acrylic resin (A) (B) 5 in total with respect to 100 parts by mass ~ 900 parts by mass, (D) 0.05 to 10 parts by mass of (A) and (B) total curing accelerator, and (E) inorganic filler (A) and (B) 100 parts by mass in total. 50-600 parts by mass, (F) diluent (A)-(D) 10-900 parts by mass, and (G) dimethyl silicone (A) (B) 100 in total The liquid resin composition containing 0.01-2 mass parts with respect to a mass part. [Selection figure] None |