| abstract |
The present invention provides a resin composition which exhibits excellent adhesive strength in the production of a semiconductor device and is inhibited from peeling off a cured product in a high temperature process. (D2) a metal salt of an organic acid having a boiling point of 200 DEG C or higher; and / or (D2) a metal salt of an organic acid having a boiling point of 200 DEG C or higher and a metal particle (A) an inorganic filler, (B) a thermosetting resin, (C) a curing agent, and (D) D1 (D2) a combination of metal particles and / or metal oxide particles with an organic acid having a boiling point of not lower than 200 占 폚, and (E ') a second antioxidant as a metal salt of an organic acid having a boiling point of not less than 200 占 폚; , An adhesive for a die attach paste or a heat dissipating member including these resin compositions, and an adhesive for a die attach paste or a heat dissipating member. |