| abstract |
The resin composition for semiconductor encapsulation of the present invention comprises a maleimide compound represented by the following formula (1) and at least one of benzoxazine compounds represented by the following formula (2-1) and the following formula (2-2) , A curing catalyst, and an inorganic filler. In the general formulas (1), (2-1) and (2-2), X 2 , X 3 and X 4 are each independently an alkylene group having 1 to 10 carbon atoms, Group, a group represented by the formula -SO 2 - or -CO-, an oxygen atom, or a single bond. |