| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0812
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J115-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L15-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2012-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2016-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-103339206-B |
| titleOfInvention |
Resin combination and semiconductor device |
| abstract |
According to the present invention, it is provided that coat operations is excellent and can give the resin combination with the reflow reliability as representative of solder resistant to semiconductor device when using as die bonding material or thermal component binding agent.The resin combination of the present invention contains: have polymer or the copolymer of the conjugated diene compound of at least 1 functional group；Thermosetting resin；With (methyl) acrylate copolymer or the copolymer with the reactive functional groups that can react with other reactive groups. |
| priorityDate |
2011-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |