| abstract |
This invention provides an adhesive composition for a semiconductor, comprising filler particles (A), a heat curing resin (B), and a sulfide bond-containing compound (C) represented by formula (1): -(S)n- (1) where n is an integer of 1 or more, wherein the compound (C) is any one of a compound (C1-1), which is a compound (C1) containing the sulfide bond and an alkoxysilyl group and wherein the content of a compound containing a disulfide bond in the compound (C1) containing the sulfide bond and the alkoxysilyl group is not less than 15% in terms of the proportion of a peak area attributable to the compound containing the disulfide bond to a total peak area of the compound (C1) containing the sulfide bond and the alkoxysilyl group, a compound (C2) containing the sulfide bond and a hydroxyl group as measured by high performance liquid chromatography, and the compound (C1); containing the sulfide bond and the alkoxysilyl group and the compound (C2) containing the sulfide bond and the hydroxyl group. |