| abstract |
The present invention provides a resin composition which exhibits excellent adhesion strength in the production of a semiconductor device and suppresses peeling of a cured product in a high-temperature process.nn n n The present invention relates to a metal salt containing (A) an inorganic filler, (B) a thermosetting resin, (C) a curing agent, (D) (D1) having an organic acid having a boiling point of 200 ° C or higher, and/or (D2) a combination of an organic acid having a boiling point of 200 ° C or higher and a metal particle and/or a metal oxide particle, and (E) a polysulfide resin composition, or (A) an inorganic filler, and (B) a thermosetting resin (C) hardener, (D) (D1) a metal salt of an organic acid having a boiling point of 200 ° C or higher and/or (D2) an organic acid having a boiling point of 200 ° C or more and metal particles and/or metal oxide particles a resin composition combining the (E') secondary antioxidant, an adhesive containing the resin composition, or an adhesive for a heat releasing member, which is produced by using the adhesive or the adhesive for a heat releasing member Semiconductor device. |